Plug and Play China Announces Call for Applications for Global Startups

The world-famous plug and play innovation platform China has announced a strategic partnership with the Hong Kong Science and Technology Park Corporation (HKSTP) and announced the call for applications for the Elevator Pitching Competition 2023 (EPiC 2023).

For the seventh consecutive year, EPiC, the Elevator Pitch Competition hosted by HKSTP, is a unique global competition for Fintech and Proptech startups looking to expand their presence in Asia and beyond by tapping into Hong Kong’s largest innovation ecosystem.

For EPiC 2023, Plug and Play will recruit startups from Asia, Europe and North America through regional competitions before the winning startups travel to Hong Kong to compete in the EPiC finals in April.

“Partnering with HKSTP for EPiC is an important step in seizing opportunities in Asia that will help us continue building the world’s leading innovation platform,” said Said Amidi, CEO of Plug and Play. “We are working with pioneers like HKSTP to build an innovation ecosystem across industries, bringing together the brightest minds with the world’s leading companies, venture capital firms, universities and government agencies.”

Fintech and Proptech startups only need to submit a two-minute video presentation to get a life-changing opportunity. The 50 shortlisted semi-finalists will receive a direct investment opportunity of up to $5 million through the HKSTP venture capital fund. They will also receive access to market expansion support in and out of Asia, as well as a $60,000 cash prize if they are successful.

“This year’s EPiC, our flagship event, promises to be the biggest and best ever through a strategic partnership with world-famous Plug and Play that strengthens HKSTP and Hong Kong as a unique global launching pad for innovators on their journey to growth and development. success.” said Albert Wong, CEO of HKSTP.